JPS6246267Y2 - - Google Patents
Info
- Publication number
- JPS6246267Y2 JPS6246267Y2 JP9908082U JP9908082U JPS6246267Y2 JP S6246267 Y2 JPS6246267 Y2 JP S6246267Y2 JP 9908082 U JP9908082 U JP 9908082U JP 9908082 U JP9908082 U JP 9908082U JP S6246267 Y2 JPS6246267 Y2 JP S6246267Y2
- Authority
- JP
- Japan
- Prior art keywords
- stem
- cylindrical body
- glass
- core
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000010949 copper Substances 0.000 description 15
- 239000011521 glass Substances 0.000 description 12
- 239000011162 core material Substances 0.000 description 10
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 5
- 229910000833 kovar Inorganic materials 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000001351 cycling effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Surface Treatment Of Glass (AREA)
- Joining Of Glass To Other Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9908082U JPS593551U (ja) | 1982-06-30 | 1982-06-30 | 半導体用ステム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9908082U JPS593551U (ja) | 1982-06-30 | 1982-06-30 | 半導体用ステム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS593551U JPS593551U (ja) | 1984-01-11 |
| JPS6246267Y2 true JPS6246267Y2 (en]) | 1987-12-12 |
Family
ID=30234957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9908082U Granted JPS593551U (ja) | 1982-06-30 | 1982-06-30 | 半導体用ステム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS593551U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0528748Y2 (en]) * | 1986-10-17 | 1993-07-23 |
-
1982
- 1982-06-30 JP JP9908082U patent/JPS593551U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS593551U (ja) | 1984-01-11 |
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